CPC B24B 49/045 (2013.01) [B24B 49/10 (2013.01); B24B 49/105 (2013.01); G01B 7/105 (2013.01); G01N 27/025 (2013.01); H01L 22/14 (2013.01); H01L 22/26 (2013.01)] | 16 Claims |
1. An apparatus for chemical mechanical polishing, comprising:
a support for a polishing pad having a polishing surface; and
an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad, the electromagnetic induction monitoring system comprising a core and an annular winding assembly,
wherein the core includes a back portion, a center post extending from the back portion in a first direction normal to the polishing surface, and an annular rim extending from the back portion in parallel with the center post and surrounding the center post and spaced apart from the center post by a gap,
and wherein the winding assembly fits in the gap between the center post and the annular rim and includes a dielectric bobbin, a coil wound around the bobbin, and a tape contacting and surrounding the coil.
|