US 12,103,134 B2
Wafer loading bracket, wafer loading system, and wafer mounting method for CMP process
Hui Xu, Zhejiang (CN); and Linghan Shen, Zhejiang (CN)
Assigned to HANGZHOU ZHONGGUI ELECTRONIC TECHNOLOGY CO., LTD, Zhejiang (CN)
Appl. No. 17/440,191
Filed by HANGZHOU ZHONGGUI ELECTRONIC TECHNOLOGY CO., LTD, Zhejiang (CN)
PCT Filed Sep. 4, 2019, PCT No. PCT/CN2019/104291
§ 371(c)(1), (2) Date Sep. 17, 2021,
PCT Pub. No. WO2020/211260, PCT Pub. Date Oct. 22, 2020.
Claims priority of application No. 201910309589.6 (CN), filed on Apr. 17, 2019.
Prior Publication US 2022/0152777 A1, May 19, 2022
Int. Cl. B24B 37/30 (2012.01); B25B 11/00 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01)
CPC B24B 37/30 (2013.01) [B25B 11/005 (2013.01); H01L 21/683 (2013.01); H01L 21/68742 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A wafer loading bracket comprises a base and a wafer holder located thereon, the wafer holder is used to place a wafer, the wafer loading bracket is matched with a polishing head for loading the wafer, and the polishing head comprises a first pressure medium cavity controlling a vertical movement of the polishing head, a second pressure medium cavity keeping the cavity closed by loading pressure, a third pressure medium cavity connected with the second pressure medium cavity and an adsorption film used to adsorb the wafer and contact with the third pressure medium cavity, wherein
the wafer holder drives the wafer to lift when the base rises, and after contacting with the adsorption film which has produced arc deformation in an outer direction of the polishing head, the wafer holder may be further lifted to make the wafer attach with the adsorption film;
the wafer holder is a basin-shaped bracket structure with high edge and low center so that during a complete contact between the wafer and the adsorption film, an edge of the wafer contacts with the wafer holder, and a central area of the wafer does not contact with the wafer holder, which avoids introducing scratches and/or particles on a lower surface of the wafer caused by squeeze of the wafer holder.