US 11,778,912 B2
Manufacturing method for piezoelectric ceramic chip, piezoelectric ceramic chip assembly and display device
Yuju Chen, Beijing (CN)
Assigned to BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Filed by BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Filed on Jun. 18, 2021, as Appl. No. 17/351,418.
Claims priority of application No. 202011296362.1 (CN), filed on Nov. 18, 2020.
Prior Publication US 2022/0158079 A1, May 19, 2022
Int. Cl. G06F 3/041 (2006.01); H10N 30/067 (2023.01); G06F 3/01 (2006.01); H10N 30/082 (2023.01)
CPC H10N 30/067 (2023.02) [G06F 3/016 (2013.01); H10N 30/082 (2023.02)] 15 Claims
OG exemplary drawing
 
1. A piezoelectric ceramic chip assembly, comprising: a base plate; and at least one first piezoelectric ceramic chip, at least one second piezoelectric ceramic chip and an insulating layer with a second opening zone disposed on the base plate;
wherein, the first piezoelectric ceramic chip comprises a first bottom electrode, a first piezoelectric ceramic layer, and a first top electrode stacked on the base plate in sequence; and
wherein, the second piezoelectric ceramic chip comprises a second top electrode disposed on the base plate, the second top electrode is located in the second opening zone of the insulating layer, and the second top electrode is spaced apart from the insulating layer.