CPC H10N 30/067 (2023.02) [G06F 3/016 (2013.01); H10N 30/082 (2023.02)] | 15 Claims |
1. A piezoelectric ceramic chip assembly, comprising: a base plate; and at least one first piezoelectric ceramic chip, at least one second piezoelectric ceramic chip and an insulating layer with a second opening zone disposed on the base plate;
wherein, the first piezoelectric ceramic chip comprises a first bottom electrode, a first piezoelectric ceramic layer, and a first top electrode stacked on the base plate in sequence; and
wherein, the second piezoelectric ceramic chip comprises a second top electrode disposed on the base plate, the second top electrode is located in the second opening zone of the insulating layer, and the second top electrode is spaced apart from the insulating layer.
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