CPC H05K 7/20318 (2013.01) [F25B 39/04 (2013.01); F28D 15/0266 (2013.01); H01L 23/427 (2013.01); H05K 7/20172 (2013.01); H05K 7/20309 (2013.01); F28F 1/022 (2013.01); F28F 2215/02 (2013.01); H05K 7/20145 (2013.01); H05K 7/20327 (2013.01)] | 9 Claims |
1. An electronic assembly comprising:
at least one semiconductor device on a printed circuit board, the at least one semiconductor device generating heat during operation of the at least one semiconductor device;
at least one evaporator on the at least one semiconductor device, the at least one evaporator configured to evaporate a coolant based on the heat generated during the operation of the at least one semiconductor device;
a collection manifold on the at least one evaporator;
a condenser on the collection manifold, the condenser including a first vertical wall defining first vertical condensation channels, a second vertical wall defining second condensation channels, a first fin connecting the first vertical wall to the second vertical wall, and a second fin connecting the first vertical wall to the second vertical wall, the first fin, the second fin, the first vertical wall, and the second vertical wall defining an airflow opening; and
at least one fan above the condenser, the at least one fan configured to generate airflow that flows horizontally over the at least one evaporator and vertically within the airflow opening.
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