US 11,778,782 B2
Condensers and electronic assemblies
Emily Cousineau, Lakewood, CO (US); Gilberto Moreno, Thornton, CO (US); Kevin Scott Bennion, Littleton, CO (US); Thomas Roan, Fargo, ND (US); and Brij N. Singh, West Fargo, ND (US)
Assigned to DEERE & COMPANY, Moline, IL (US); and ALLIANCE FOR SUSTAINABLE ENERGY, LLC, Golden, CO (US)
Filed by Deere & Company, Moline, IL (US); and Alliance for Sustainable Energy, LLC, Golden, CO (US)
Filed on May 9, 2022, as Appl. No. 17/739,348.
Application 17/739,348 is a division of application No. 16/870,320, filed on May 8, 2020, granted, now 11,388,840.
Claims priority of provisional application 63/009,789, filed on Apr. 14, 2020.
Prior Publication US 2022/0279681 A1, Sep. 1, 2022
Int. Cl. H05K 7/20 (2006.01); F25B 39/04 (2006.01); H01L 23/427 (2006.01); F28D 15/02 (2006.01); F28F 1/02 (2006.01)
CPC H05K 7/20318 (2013.01) [F25B 39/04 (2013.01); F28D 15/0266 (2013.01); H01L 23/427 (2013.01); H05K 7/20172 (2013.01); H05K 7/20309 (2013.01); F28F 1/022 (2013.01); F28F 2215/02 (2013.01); H05K 7/20145 (2013.01); H05K 7/20327 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An electronic assembly comprising:
at least one semiconductor device on a printed circuit board, the at least one semiconductor device generating heat during operation of the at least one semiconductor device;
at least one evaporator on the at least one semiconductor device, the at least one evaporator configured to evaporate a coolant based on the heat generated during the operation of the at least one semiconductor device;
a collection manifold on the at least one evaporator;
a condenser on the collection manifold, the condenser including a first vertical wall defining first vertical condensation channels, a second vertical wall defining second condensation channels, a first fin connecting the first vertical wall to the second vertical wall, and a second fin connecting the first vertical wall to the second vertical wall, the first fin, the second fin, the first vertical wall, and the second vertical wall defining an airflow opening; and
at least one fan above the condenser, the at least one fan configured to generate airflow that flows horizontally over the at least one evaporator and vertically within the airflow opening.