US 11,778,760 B2
Chip packaging structure and display device
Peng Ding, Beijing (CN); Zhixiang Fang, Beijing (CN); Guanglei Yang, Beijing (CN); Meng Wang, Beijing (CN); and Xuxu Hu, Beijing (CN)
Assigned to Hefei BOE Optoelectronics Technology Co., Ltd., Anhui (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
Appl. No. 17/417,837
Filed by Hefei BOE Optoelectronics Technology Co., Ltd., Hefei (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Dec. 24, 2020, PCT No. PCT/CN2020/139093
§ 371(c)(1), (2) Date Jun. 24, 2021,
PCT Pub. No. WO2021/136069, PCT Pub. Date Jul. 8, 2021.
Claims priority of application No. 202010005854.4 (CN), filed on Jan. 3, 2020.
Prior Publication US 2023/0007793 A1, Jan. 5, 2023
Int. Cl. H05K 5/00 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01)
CPC H05K 5/0069 (2013.01) [H05K 1/111 (2013.01); H05K 1/148 (2013.01); H05K 5/0018 (2022.08); H05K 2201/09418 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A chip packaging structure, comprising at least one chip packaging unit, the chip packaging unit comprising:
a flexible substrate, the flexible substrate comprising a first flexible substrate body, a plurality of first traces arranged on the first flexible substrate body, and a plurality of input pads and a plurality of output pads arranged on the first flexible substrate body, the plurality of input pads and the plurality of output pads being connected in one-to-one correspondence through the first traces; and
a rigid substrate, the rigid substrate comprising a rigid substrate body and a chip arranged on the rigid substrate body;
wherein the rigid substrate is bonded to a drive printed circuit board of a display device;
a side of the flexible substrate is bonded to the rigid substrate, and another side of the flexible substrate is bonded to a display panel of the display device; and the plurality of input pads are electrically connected to the chip, and the plurality of output pads are configured to transmit signals to the display panel.