CPC H01L 23/40 (2013.01) [H05K 7/20509 (2013.01)] | 15 Claims |
1. A heat sink comprising:
a first flange;
a second flange;
an accordion-shaped medial portion continuous between the first flange and the second flange; and
a spring pin,
wherein:
the first flange and the second flange are configured to be attached directly onto a top surface of a circuit board;
the accordion-shaped medial portion includes troughs on a proximal side of the accordion-shaped medial portion and crests on a distal side of the accordion-shaped medial portion such that the heat sink is configured to disperse heat away from the circuit board;
the accordion-shaped medial portion includes planar sections between the troughs and the crests;
at least one of the planar sections has a height which is different than a height of each of a remainder of the planar sections such that the heat sink is shaped for accommodating components of various sizes on the circuit board; and
the spring pin is configured to attach the first flange or the second flange directly to the circuit board.
|