US 11,776,846 B2
Methods for depositing gap filling fluids and related systems and devices
Timothee Blanquart, Oud-Heverlee (BE)
Assigned to ASM IP Holding B.V., Almere (NL)
Filed by ASM IP Holding B.V., Almere (NL)
Filed on Jan. 25, 2021, as Appl. No. 17/157,467.
Claims priority of provisional application 62/971,686, filed on Feb. 7, 2020.
Prior Publication US 2021/0249303 A1, Aug. 12, 2021
Int. Cl. H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01J 37/32 (2006.01); C23C 16/34 (2006.01); C23C 16/455 (2006.01); C23C 16/52 (2006.01)
CPC H01L 21/76837 (2013.01) [C23C 16/345 (2013.01); C23C 16/45536 (2013.01); C23C 16/45544 (2013.01); C23C 16/52 (2013.01); H01J 37/32449 (2013.01); H01J 37/32834 (2013.01); H01J 37/32899 (2013.01); H01L 21/0234 (2013.01); H01L 21/02211 (2013.01); H01L 21/02274 (2013.01); H01J 2237/332 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method of filling a gap comprising:
introducing in a reactor chamber a substrate provided with a gap, the gap comprising a recess and a lateral space extending substantially laterally from the recess;
introducing a precursor into the reactor chamber;
introducing a co-reactant into the reactor chamber; and,
generating a plasma in the reactor chamber; whereby the precursor and the co-reactant react to form a gap filling fluid that at least partially fills the recess and the lateral space of the gap,
wherein the method comprises a plurality of cycles, a cycle comprising a gap filling fluid deposition step and a curing step, wherein the curing step comprises subjecting the substrate to a direct plasma; and
wherein the curing step comprises subjecting the substrate to a micro pulsed plasma comprising a plurality of micro pulse cycles, a micro pulse cycle comprising a plasma on pulse and a plasma off pulse.