CPC H01B 1/22 (2013.01) | 15 Claims |
1. A flexible conductive paste, comprising:
3% to 7% by weight of a film former;
20% to 50% by weight of a conductive powder;
25% to 45% by weight of a liquid metal microcapsule;
10% to 30% by weight of a solvent;
0.1% to 5% by weight of a curing agent; and
0.5% to 5% by weight of a functional additive,
wherein a wall of the liquid metal microcapsule is a coating resin, a core of the liquid metal microcapsule is a liquid metal, and the liquid metal has a melting point Tm smaller than or equal to T1; the film former has a molecular weight within a range of 15000 to 30000, and has a glass transition temperature Tg smaller than or equal to T1; wherein T1 is a temperature at which a flexible conductive circuit made of the flexible conductive paste is deformed.
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