US 11,776,709 B2
Flexible conductive paste and flexible electronic device
Shijin Dong, Beijing (CN); and Zhenlong Men, Beijing (CN)
Assigned to Beijing Dream Ink Technologies Co., Ltd., Beijing (CN)
Appl. No. 17/622,710
Filed by Beijing Dream Ink Technologies Co., Ltd., Beijing (CN)
PCT Filed Apr. 12, 2021, PCT No. PCT/CN2021/086631
§ 371(c)(1), (2) Date Dec. 24, 2021,
PCT Pub. No. WO2021/208858, PCT Pub. Date Oct. 21, 2021.
Claims priority of application No. 202010302490.6 (CN), filed on Apr. 17, 2020.
Prior Publication US 2022/0254541 A1, Aug. 11, 2022
Int. Cl. H01B 1/22 (2006.01)
CPC H01B 1/22 (2013.01) 15 Claims
OG exemplary drawing
 
1. A flexible conductive paste, comprising:
3% to 7% by weight of a film former;
20% to 50% by weight of a conductive powder;
25% to 45% by weight of a liquid metal microcapsule;
10% to 30% by weight of a solvent;
0.1% to 5% by weight of a curing agent; and
0.5% to 5% by weight of a functional additive,
wherein a wall of the liquid metal microcapsule is a coating resin, a core of the liquid metal microcapsule is a liquid metal, and the liquid metal has a melting point Tm smaller than or equal to T1; the film former has a molecular weight within a range of 15000 to 30000, and has a glass transition temperature Tg smaller than or equal to T1; wherein T1 is a temperature at which a flexible conductive circuit made of the flexible conductive paste is deformed.