US 11,776,708 B2
Liquid metal conductive paste and electronic device
Ping Li, Beijing (CN); Shijin Dong, Beijing (CN); and Zhenlong Men, Beijing (CN)
Assigned to Beijing Dream Ink Technologies Co., Ltd., Beijing (CN)
Appl. No. 17/622,695
Filed by Beijing Dream Ink Technologies Co., Ltd., Beijing (CN)
PCT Filed Dec. 16, 2020, PCT No. PCT/CN2020/136874
§ 371(c)(1), (2) Date Dec. 23, 2021,
PCT Pub. No. WO2021/121278, PCT Pub. Date Jun. 24, 2021.
Claims priority of application No. 201911313432.7 (CN), filed on Dec. 19, 2019.
Prior Publication US 2022/0262538 A1, Aug. 18, 2022
Int. Cl. H01B 1/22 (2006.01)
CPC H01B 1/22 (2013.01) 20 Claims
OG exemplary drawing
 
1. A liquid metal conductive paste, comprising:
1% to 50% by weight of a liquid metal microcapsule;
30% to 80% by weight of a conductive powder;
1% to 25% by weight of a base polymer; and
10% to 40% by weight of a solvent,
wherein the liquid metal microcapsule has a capsule wall of a coating polymer, and a capsule core of a liquid metal; and melting point of the liquid metal satisfies a condition that the liquid metal is in a liquid state at least when a wire made of the liquid metal conductive paste is deformed.