CPC H01B 1/22 (2013.01) | 20 Claims |
1. A liquid metal conductive paste, comprising:
1% to 50% by weight of a liquid metal microcapsule;
30% to 80% by weight of a conductive powder;
1% to 25% by weight of a base polymer; and
10% to 40% by weight of a solvent,
wherein the liquid metal microcapsule has a capsule wall of a coating polymer, and a capsule core of a liquid metal; and melting point of the liquid metal satisfies a condition that the liquid metal is in a liquid state at least when a wire made of the liquid metal conductive paste is deformed.
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