US 11,776,109 B2
Thickness measurement of substrate using color metrology
Nojan Motamedi, Sunnyvale, CA (US); Dominic J. Benvegnu, La Honda, CA (US); Boguslaw A. Swedek, Morgan Hill, CA (US); and Martin A. Josefowicz, Lincoln, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jul. 29, 2021, as Appl. No. 17/388,961.
Application 17/388,961 is a continuation of application No. 16/414,709, filed on May 16, 2019, granted, now 11,100,628.
Claims priority of provisional application 62/802,662, filed on Feb. 7, 2019.
Prior Publication US 2021/0358113 A1, Nov. 18, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. G06T 7/00 (2017.01); G06T 5/00 (2006.01); H01L 21/67 (2006.01); G01B 11/06 (2006.01)
CPC G06T 7/0006 (2013.01) [G01B 11/06 (2013.01); G06T 5/009 (2013.01); H01L 21/67253 (2013.01); G01B 2210/56 (2013.01); G06T 2207/10024 (2013.01); G06T 2207/20208 (2013.01); G06T 2207/30148 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A system for obtaining a measurement representative of a thickness of a layer on a substrate, comprising:
a support to hold a substrate for integrated circuit fabrication;
an optical sensor to capture a color image of at least a portion of the substrate held by the support; and
a controller configured to
receive the color image from the optical sensor,
perform a color correction on the color image to generate an adjusted color image having increased color contrast;
for a pixel of the adjusted color image, determine a coordinate of the pixel in a coordinate space of at least two dimensions including a first color channel and a second color channel from color data in the adjusted color image for the pixel, and
calculate a value representative of a thickness based on the coordinate of the pixel of the adjusted color image in the coordinate space.