US 11,774,686 B2
Edge couplers including a rounded region adjacent to an opening in the interconnect structure
Brett Cucci, Colchester, VT (US); Yusheng Bian, Ballston Lake, NY (US); Abdelsalam Aboketaf, Essex Junction, VT (US); Edward Kiewra, South Burlington, VT (US); and Robert K. Leidy, Burlington, VT (US)
Assigned to GlobalFoundries U.S. Inc., Santa Clara, CA (US)
Filed by GLOBALFOUNDRIES U.S. Inc., Santa Clara, CA (US)
Filed on May 6, 2021, as Appl. No. 17/313,472.
Prior Publication US 2022/0357530 A1, Nov. 10, 2022
Int. Cl. G02B 6/42 (2006.01)
CPC G02B 6/4206 (2013.01) 20 Claims
OG exemplary drawing
 
1. A structure comprising:
a first dielectric layer;
a waveguide core on the first dielectric layer; and
an interconnect structure including a first interlayer dielectric layer positioned over the first dielectric layer and an opening penetrating through the first interlayer dielectric layer to the waveguide core, the first interlayer dielectric layer including a first rounded region positioned to overlap with a first portion of the waveguide core, and the first rounded region of the first interlayer dielectric layer having a first surface with a first curvature,
wherein the first portion of the waveguide core has a first width dimension, and the first rounded region of the first interlayer dielectric layer has a second width dimension that is greater than the first width dimension of the waveguide core.