CPC G02B 6/4206 (2013.01) | 20 Claims |
1. A structure comprising:
a first dielectric layer;
a waveguide core on the first dielectric layer; and
an interconnect structure including a first interlayer dielectric layer positioned over the first dielectric layer and an opening penetrating through the first interlayer dielectric layer to the waveguide core, the first interlayer dielectric layer including a first rounded region positioned to overlap with a first portion of the waveguide core, and the first rounded region of the first interlayer dielectric layer having a first surface with a first curvature,
wherein the first portion of the waveguide core has a first width dimension, and the first rounded region of the first interlayer dielectric layer has a second width dimension that is greater than the first width dimension of the waveguide core.
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