US 11,774,519 B2
Shielded sensor structure and method of making same
Yong Deng, Stanford, CA (US); Jo Bito, Dallas, TX (US); and Benjamin Stassen Cook, Los Gatos, CA (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Aug. 26, 2020, as Appl. No. 17/3,693.
Claims priority of provisional application 62/892,387, filed on Aug. 27, 2019.
Prior Publication US 2021/0063497 A1, Mar. 4, 2021
Int. Cl. G01R 33/00 (2006.01); G01R 33/07 (2006.01); H05K 9/00 (2006.01)
CPC G01R 33/0076 (2013.01) [G01R 33/07 (2013.01); H05K 9/0045 (2013.01); H05K 9/0075 (2013.01)] 27 Claims
OG exemplary drawing
 
1. An integrated circuit, comprising:
a substrate having a substrate surface and including an electrically conductive lead;
a semiconductor die on the substrate surface, the semiconductor die including a sensor;
a structure around the semiconductor die and the substrate, in which the structure has six sides, and the conductive lead includes a segment that extends out of a first side of the structure perpendicular to the substrate surface; and
a magnetic shield layer on external surfaces of second, third, fourth, and fifth sides of the structure.