CPC G01R 33/0076 (2013.01) [G01R 33/07 (2013.01); H05K 9/0045 (2013.01); H05K 9/0075 (2013.01)] | 27 Claims |
1. An integrated circuit, comprising:
a substrate having a substrate surface and including an electrically conductive lead;
a semiconductor die on the substrate surface, the semiconductor die including a sensor;
a structure around the semiconductor die and the substrate, in which the structure has six sides, and the conductive lead includes a segment that extends out of a first side of the structure perpendicular to the substrate surface; and
a magnetic shield layer on external surfaces of second, third, fourth, and fifth sides of the structure.
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