US 11,773,254 B2
Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods
Brett A. Beiermann, St. Paul, MN (US); John C. Clark, Maplewood, MN (US); Eric G. Larson, Lake Elmo, MN (US); Jeremy M. Higgins, Roseville, MN (US); Audrey S. Forticaux, Minneapolis, MN (US); Jay R. Lomeda, St. Paul, MN (US); Wayne S. Mahoney, St. Paul, MN (US); Scott B. Charles, Spring Valley, WI (US); Timothy D. Fletcher, Lino Lakes, MN (US); Wendy L. Thompson, Roseville, MN (US); and Kyle R. Schwartz, Maplewood, MN (US)
Assigned to 3M Innovative Properties Company, St. Paul, MN (US)
Appl. No. 16/756,518
Filed by 3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US)
PCT Filed Dec. 21, 2018, PCT No. PCT/US2018/067091
§ 371(c)(1), (2) Date Apr. 16, 2020,
PCT Pub. No. WO2019/133482, PCT Pub. Date Jul. 4, 2019.
Claims priority of provisional application 62/610,639, filed on Dec. 27, 2017.
Prior Publication US 2020/0283619 A1, Sep. 10, 2020
Int. Cl. C08L 63/00 (2006.01); C08K 3/14 (2006.01); C08K 3/22 (2006.01); C08K 3/38 (2006.01); C08K 7/20 (2006.01); H05K 5/02 (2006.01)
CPC C08L 63/00 (2013.01) [C08K 3/14 (2013.01); C08K 3/22 (2013.01); C08K 3/38 (2013.01); C08K 7/20 (2013.01); H05K 5/02 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); C08K 2201/009 (2013.01)] 33 Claims
 
1. An electronic device selected from a phone, tablet, laptop, or mouse comprising an enclosure that is a housing or case, wherein the housing or case comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles; wherein the cured epoxy resin composition comprises a plurality of microspheres partially embedded in the cured epoxy resin composition.