CPC C08L 63/00 (2013.01) [C08K 3/14 (2013.01); C08K 3/22 (2013.01); C08K 3/38 (2013.01); C08K 7/20 (2013.01); H05K 5/02 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); C08K 2201/009 (2013.01)] | 33 Claims |
1. An electronic device selected from a phone, tablet, laptop, or mouse comprising an enclosure that is a housing or case, wherein the housing or case comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles; wherein the cured epoxy resin composition comprises a plurality of microspheres partially embedded in the cured epoxy resin composition.
|