US 12,433,082 B2
Flexible micro-LED display panel and manufacturing method thereof
Zhuhui Li, Guangdong (CN)
Assigned to Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Shenzhen (CN)
Appl. No. 17/417,467
Filed by Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Guangdong (CN)
PCT Filed Dec. 30, 2020, PCT No. PCT/CN2020/141376
§ 371(c)(1), (2) Date Jun. 23, 2021,
PCT Pub. No. WO2021/244022, PCT Pub. Date Dec. 9, 2021.
Claims priority of application No. 202010507058.0 (CN), filed on Jun. 5, 2020.
Prior Publication US 2022/0336525 A1, Oct. 20, 2022
Int. Cl. H01L 27/15 (2006.01); H01L 33/56 (2010.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01); H10H 20/854 (2025.01); H10H 20/855 (2025.01); H10H 29/14 (2025.01)
CPC H10H 29/142 (2025.01) [H10D 86/441 (2025.01); H10D 86/60 (2025.01); H10H 20/854 (2025.01); H10H 20/855 (2025.01)] 17 Claims
OG exemplary drawing
 
1. A flexible micro-LED display panel, comprising:
an array substrate, comprising a first base substrate and a thin film transistor array layer disposed on the first base substrate;
a first connecting electrode layer, disposed on the thin film transistor array layer and electrically connected to the thin film transistor array layer;
a second connecting electrode layer, disposed on the first connecting electrode layer;
a plurality of micro-LED chips, arranged on the second connecting electrode layer, and connected to the thin film transistor array layer via the first connecting electrode layer and the second connecting electrode layer, wherein a first pin and a second pin are provided on a side of each of the micro-LED chips close to the second connecting electrode layer, and the first pin and the second pin are connected to the second connecting electrode layer to achieve die bonding;
a flexible encapsulation layer, covering the micro-LED chips; and
a second base substrate, disposed on the flexible encapsulation layer and being directly in contact with the flexible encapsulation layer,
wherein the first base substrate and the second base substrate are both flexible substrates, the flexible display panel has a neutral layer located at the thin film transistor array layer, and the neutral layer is an imaginary horizontal line at which a stress received by the flexible micro-LED display panel during folding and bending is zero; and
wherein the first base substrate and the second base substrate are respectively located on two opposite sides of a combined structure of the micro-LED chips and the flexible encapsulation layer.