| CPC H10H 20/856 (2025.01) [H10H 20/851 (2025.01); H10H 20/0361 (2025.01); H10H 20/0363 (2025.01)] | 13 Claims |
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1. A method of manufacturing a light-emitting device package comprising:
preparing a plurality of LED chips comprising a substrate having an upper surface, a semiconductor laminate structure formed under the substrate, and a first conductive connection pad and a second conductive connection pad formed under the semiconductor laminate structure;
forming a wavelength conversion sheet directly on an upper surface of a temporary support sheet from a mixture comprising a fluorescent substance and an encapsulant;
arranging upper surfaces of the plurality of LED chips on the wavelength conversion sheet;
forming a light transmitting member between a side surface of each of the plurality of LED chips and one surface of the wavelength conversion sheet adjacent to the side surfaces of the plurality of LED chips by an injection method;
cutting the wavelength conversion sheet between the plurality of LED chips to form a plurality of wavelength conversion members arranged at predetermined intervals on the temporary support sheet;
filling a reflective material between the plurality of LED chips and the plurality of wavelength conversion members;
forming a reflector comprising
a first region covering a side surface of each of the wavelength conversion members and the light transmitting member and
a second region covering the light transmitting member and exposing the side surface of each of the wavelength conversion members; and
after forming the reflective material, removing the temporary support sheet by which the plurality of LED chips are individually separated,
wherein the maximum height of the filled reflective material corresponds to a distance between the upper surface of the temporary support sheet and the exposed surfaces of the first and second conductive connection pads formed on the LED chips, and
wherein forming the reflector comprises:
cutting the wavelength conversion members to form the first regions of the reflective material that cover the side surfaces of the wavelength conversion members and the light transmitting members; and
removing portions of the reflective material between the wavelength conversion members that do not form the first regions to create the second regions that cover the light transmitting members and expose the side surfaces of the wavelength conversion members.
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