US 12,433,071 B2
Method for producing an optoelectronic component and optoelectronic component
Vesna Müller, Vaterstetten (DE); David O'Brien, Portland, OR (US); Gerhard Domann, Würzburg (DE); and Peer Löbmann, Würzburg (DE)
Assigned to OSRAM Opto Semiconductors GmbH, Regensburg (DE); and Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V., Munich (DE)
Appl. No. 17/611,502
Filed by OSRAM Opto Semiconductors GmbH, Regensburg (DE); and Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V., Munich (DE)
PCT Filed Apr. 15, 2020, PCT No. PCT/EP2020/060599
§ 371(c)(1), (2) Date Nov. 15, 2021,
PCT Pub. No. WO2020/229078, PCT Pub. Date Nov. 19, 2020.
Claims priority of application No. 10 2019 112 955.9 (DE), filed on May 16, 2019.
Prior Publication US 2022/0209073 A1, Jun. 30, 2022
Int. Cl. H10H 20/84 (2025.01); C09D 183/04 (2006.01); H10H 20/01 (2025.01); H10H 20/851 (2025.01)
CPC H10H 20/84 (2025.01) [C09D 183/04 (2013.01); H10H 20/01 (2025.01); H10H 20/8512 (2025.01); H10H 20/034 (2025.01); H10H 20/0361 (2025.01)] 19 Claims
OG exemplary drawing
 
1. Method for producing an optoelectronic component with the steps
providing monomeric structural units,
providing nanoparticles in a liquid medium,
mixing the monomeric structural units and the nanoparticles in the liquid medium so that a starting sol is formed,
introducing an acid into the starting sol to adjust a pH value,
at least partial condensation of the monomeric structural units to form a network, wherein the nanoparticles are at least partially covalently bonded to the network, so that a sol-gel material is formed,
applying the sol-gel material to a semiconductor chip,
curing the sol-gel material so that a coating material is formed.