US 12,432,974 B2
Semiconductor device
Beom Jin Park, Suwon-si (KR); Myung Gil, Suwon-si (KR); Dong Won, Suwon-si (KR); and Keun Hwi, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Dec. 6, 2022, as Appl. No. 18/062,116.
Claims priority of application No. 10-2022-0052580 (KR), filed on Apr. 28, 2022.
Prior Publication US 2024/0186392 A1, Jun. 6, 2024
Int. Cl. H10D 30/67 (2025.01); H10D 30/43 (2025.01); H10D 62/10 (2025.01); H10D 64/23 (2025.01); H10D 84/83 (2025.01)
CPC H10D 30/6735 (2025.01) [H10D 30/43 (2025.01); H10D 62/121 (2025.01); H10D 64/258 (2025.01); H10D 84/83 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a substrate;
a first active pattern extending in a first horizontal direction on the substrate;
a second active pattern extending in the first horizontal direction on the substrate, and spaced apart from the first active pattern in the first horizontal direction;
a first plurality of nanosheets spaced apart from each other in a vertical direction on the first active pattern;
a second plurality of nanosheets spaced apart from each other in the vertical direction on the first and second active patterns;
a first gate electrode extending in a second horizontal direction different from the first horizontal direction on the first active pattern, and surrounding the first plurality of nanosheets;
a source/drain region between the first plurality of nanosheets and the second plurality of nanosheets;
an active cut penetrating the plurality of second nanosheets in the vertical direction, extending to the substrate, and separating the first and second active patterns; and
a sacrificial layer between the source/drain region and the active cut, being in contact with the active cut, and including silicon germanium (SiGe).