US 12,432,973 B2
Semiconductor device
Beomjin Park, Hwaseong-si (KR); Hyojin Kim, Hwaseong-si (KR); Myung Gil Kang, Suwon-si (KR); Jinbum Kim, Seoul (KR); Sangmoon Lee, Suwon-si (KR); Dongwon Kim, Seongnam-si (KR); and Keun Hwi Cho, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Apr. 20, 2022, as Appl. No. 17/725,180.
Claims priority of application No. 10-2021-0107077 (KR), filed on Aug. 13, 2021.
Prior Publication US 2023/0051602 A1, Feb. 16, 2023
Int. Cl. H10D 30/67 (2025.01); H10D 64/01 (2025.01)
CPC H10D 30/6735 (2025.01) [H10D 30/6713 (2025.01); H10D 30/6757 (2025.01); H10D 64/021 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
an active pattern provided on a substrate and extending in a first direction;
a pair of source/drain patterns provided on the active pattern and spaced apart from each other in the first direction;
a plurality of channel layers vertically stacked and spaced apart from each other on the active pattern between the pair of source/drain patterns;
a gate electrode extending in a second direction between the pair of source/drain patterns, the gate electrode being provided on the active pattern and surrounding the plurality of channel layers, and the second direction intersecting the first direction; and
a gate spacer provided between the plurality of channel layers, and between the gate electrode and the pair of source/drain patterns,
wherein the gate spacer comprises a plurality of first spacer patterns and a plurality of second spacer patterns that are alternately stacked on sidewalls of the pair of source/drain patterns,
wherein each of the plurality of first spacer patterns is a semiconductor spacer pattern, and
wherein each of the plurality of second spacer patterns is a dielectric spacer pattern comprising silicon.