US 12,432,881 B2
Compact form factor cooling assembly retention system
Shahin Amiri, Richmond Hill (CA); Mirui Wang, Oshawa (CA); Saman Nasirahmadi, Newmarket (CA); Ali Kalantarian, Richmond Hill (CA); and Tejas Shah, Austin, TX (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Mar. 31, 2022, as Appl. No. 17/711,007.
Prior Publication US 2023/0320036 A1, Oct. 5, 2023
Int. Cl. H05K 7/20 (2006.01); F16B 5/02 (2006.01); H05K 1/02 (2006.01)
CPC H05K 7/2039 (2013.01) [F16B 5/02 (2013.01); H05K 1/0204 (2013.01); H05K 7/20136 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a bolt to be inserted through a first hole in a cooling mass, a second hole in a planar mechanical element and a third hole in an electronic circuit board when the first, second and third holes are aligned;
a first spring element to be coupled to the cooling mass and the bolt, the first spring element to be deformed from its nominal shape when the bolt is fastened to the electronic circuit board to draw a base of the cooling mass toward the electronic circuit board; and
a second spring element to be coupled to the planar mechanical element and the bolt, the second spring element to be deformed from its nominal shape to draw the planar mechanical element toward the electronic circuit board.