US 12,432,880 B2
Integrated bracket for enhanced heat dissipation
Shiva Pahwa, Bangalore (IN); Abhilash Ramamurthy Nag, Bangalore (IN); and Suresh Reddy Yarragunta, Bangalore (IN)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Aug. 29, 2023, as Appl. No. 18/239,427.
Claims priority of application No. 202241049779 (IN), filed on Aug. 31, 2022.
Prior Publication US 2024/0074110 A1, Feb. 29, 2024
Int. Cl. H05K 7/20 (2006.01); F28F 3/04 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20336 (2013.01) [F28F 3/048 (2013.01); G06F 1/20 (2013.01); H05K 7/20409 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A peripheral component interconnect express (PCIe) assembly comprising:
a controller and NOT AND (NAND) devices;
a top heatsink configured to transfer heat from the NAND devices coupled to the top heatsink;
a bottom cover configured to provide protection to components within the PCIe assembly from physical damage; and
an input/output bracket (IO bracket) positioned between the top heatsink and the bottom cover, the IO bracket including at least one heat pipe coupled to the controller, the IO bracket configured to transfer heat from the controller.