| CPC H05K 7/20254 (2013.01) [H01L 23/4735 (2013.01); H05K 1/0203 (2013.01); H05K 7/20272 (2013.01)] | 21 Claims |
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1. A cooling module, comprising:
(a) a jet plate comprising an upper face, a lower face, a first segment that includes a first array of microjet nozzles extending through the jet plate from the upper face of the jet plate to the lower face of the jet plate, and a second segment that includes second array of microjet nozzles extending through the jet plate from the upper face of the jet plate to the lower face of the jet plate, and
(b) a housing;
(c) a ceiling disposed between the jet plate and the housing, the ceiling comprising a first ceiling-mounted boundary extending from the ceiling to the upper face of the jet plate and a second ceiling-mounted boundary extending from the ceiling to the upper face of the jet plate,
(d) a base plate comprising a cooling surface, a first cooling surface-mounted boundary extending from the cooling surface to the lower face of the jet plate, and a second cooling surface-mounted boundary extending from the cooling surface to the lower face of the jet plate;
(e) wherein the jet plate, the ceiling, the cooling surface of the base plate, the first ceiling-mounted boundary, the second ceiling-mounted boundary, the first cooling surface-mounted boundary and the second cooling surface-mounted boundary are all arranged to define a first inlet plenum located between the ceiling and the first array of microjet nozzles, a second inlet plenum located between the ceiling and the second array of microjet nozzles, a first impingement volume located between the first array of microjet nozzles and the cooling surface, a second impingement volume located between the second array of microjet nozzles and the cooling surface, and a first couch passage fluidly connecting the first impingement volume to the second inlet plenum;
(f) a fastening system for attaching the cooling module to a circuit board having one or more heat-generating electronic components affixed thereto so that the cooling surface of the base plate will be in thermal communication with said one or more heat-generating electronic components on the circuit board and absorbs heat generated by said one or more heat-generating electronic components while the circuit board is in operation; and
(g) an inlet fitting attached to the housing and configured to admit into the cooling module a pressurized coolant fluid transferred from an external source; and
(h) an inlet flow channel to carry the pressurized liquid coolant fluid from the inlet fitting to the first inlet plenum;
(i) wherein,
(i) the first array of microjet nozzles in the first segment of the jet plate is configured to receive the pressurized coolant fluid from the first inlet plenum, accelerate the pressurized coolant fluid and direct the accelerated and pressurized coolant fluid to flow into the first impingement volume at high velocity to strike a first portion of the cooling surface of the base plate, thereby removing the heat that the first portion of the cooling surface has absorbed from said one or more heat-generating electronic components,
(ii) the couch passage is configured to carry some of the pressurized coolant fluid of the first impingement volume and into the second inlet plenum, and
(iii) the second array of microjet nozzles in the jet plate is configured to receive the pressurized coolant fluid from the second inlet plenum, accelerate the pressurized coolant fluid and direct the accelerated and pressurized coolant fluid to flow into the second impingement volume at high velocity to strike a second portion of the cooling surface of the base plate, thereby removing the heat that the second portion of the cooling surface has absorbed from said one or more heat-generating electronic components.
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