US 12,432,877 B2
Polymeric cold plate for thermal management of power electronics
Timothy Unton, Indianapolis, IN (US); and Eric Donovan, Indianapolis, IN (US)
Assigned to Rolls-Royce North American Technologies Inc., Indianapolis, IN (US)
Filed by Rolls-Royce North American Technologies Inc., Indianapolis, IN (US)
Filed on Jun. 14, 2023, as Appl. No. 18/209,664.
Prior Publication US 2024/0422950 A1, Dec. 19, 2024
Int. Cl. H05K 7/20 (2006.01); H01L 23/40 (2006.01); H01L 23/473 (2006.01)
CPC H05K 7/20254 (2013.01) [H01L 23/473 (2013.01); H01L 23/4006 (2013.01); H05K 7/20772 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A power electronic assembly comprising:
a power electronic that includes a circuit board and a processor coupled with the circuit board, the processor configured to be powered by electric energy and to generate waste heat from the electric energy, the processor having a planar external surface opposite the circuit board, and
a cold plate configured to transfer the waste heat generated by the processor away from the processor, the cold plate including a polymeric coolant housing that defines a fluid channel therethrough and a back plate coupled with the polymeric coolant housing to close a mouth of the fluid channel, the polymeric coolant housing configured to receive and pass a flow of cooling fluid through the fluid channel and to deform elastically in response to receiving the flow of cooling fluid to provide uniform contact and heat transfer between the polymeric coolant housing and the planar external surface of the processor,
wherein the polymeric coolant housing includes a first end wall having an inlet that opens into the fluid channel, a second end wall having an outlet that opens into the fluid channel, and a membrane made of polymeric material that extends between and interconnects the first end wall and the second end wall, and the membrane is configured to deform elastically and expand outward away from the back plate and into direct contact with the external surface of the processor in response to the cold plate receiving fluid through the flow channel.