US 12,432,875 B2
Immersion cooling unit and electronic apparatus
Cheng Han Chiang, New Taipei (TW); Shao-Jen Chu, New Taipei (TW); and Cheng Wei Chen, New Taipei (TW)
Assigned to Wistron Corporation, New Taipei (TW)
Filed by Wistron Corporation, New Taipei (TW)
Filed on Dec. 7, 2022, as Appl. No. 18/077,160.
Claims priority of application No. 111129016 (TW), filed on Aug. 2, 2022.
Prior Publication US 2024/0049424 A1, Feb. 8, 2024
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20236 (2013.01) [H05K 7/20272 (2013.01); H05K 7/20409 (2013.01); H05K 7/20481 (2013.01); H05K 7/20627 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An immersion cooling unit comprising:
a cooling tank comprising an accommodating portion and a top, wherein the immersion cooling unit is a single-phase cooling unit;
a first cooling unit connected to the cooling tank;
a second cooling unit, wherein the first cooling unit and the second cooling unit are disposed opposite to each other, and the second cooling unit comprises a cover portion and a connection portion, wherein the cover portion is connected to the top of the cooling tank and covers the accommodating portion, and the connection portion is connected to the cover portion and contacts a heat generating component, and the connection portion is located in the accommodating portion; and
two cooling pipes, respectively disposed in the cover portion and the first cooling unit, the two cooling pipes are filled with a coolant,
a cooling medium is accommodated in the accommodating portion of the cooling tank and the cooling medium is different from the coolant.