US 12,432,863 B1
Solder preform assembly and methods of preforming solder for electronic board assembly
Timothy Mark Force, Jr., Raymore, MO (US); Lucas Alan Mann, Lee's Summit, MO (US); and Bryan Alan Hildreth, Gardner, KS (US)
Assigned to Honeywell Federal Manufacturing & Technologies, LLC, Kansas City, MO (US)
Filed by Honeywell Federal Manufacturing & Technologies, LLC, Kansas City, MO (US)
Filed on Sep. 27, 2024, as Appl. No. 18/899,077.
Int. Cl. H05K 3/34 (2006.01)
CPC H05K 3/3478 (2013.01) [H05K 3/3494 (2013.01); H05K 2203/041 (2013.01); H05K 2203/043 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of preparing an electronic board with solder preloads using a preload assembly comprising a base and an inset plate, the method comprising:
receiving the inset plate in a base recess of the base;
receiving a solder paste in a preload hole of the inset plate;
receiving a pin of an electrical component in the preload hole;
applying heat to the solder paste to a melting point of the solder paste;
cooling the solder paste to bond the solder paste to the pin to form a solder preload;
removing the electrical component from the preload hole of the inset plate;
inserting the pin of the electrical component into a pinhole of the electronic board; and
reheating and re-cooling the solder preload to bond the pin to a conductor of the electronic board.