US 12,432,860 B2
Electronic device
Akihiro Masuda, Tokyo (JP); Katsuya Miura, Tokyo (JP); and Natsuki Kumagai, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Nov. 29, 2023, as Appl. No. 18/522,664.
Claims priority of application No. 2022-198936 (JP), filed on Dec. 13, 2022.
Prior Publication US 2024/0196538 A1, Jun. 13, 2024
Int. Cl. H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/183 (2013.01) [H05K 1/0203 (2013.01); H05K 2201/09372 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/1003 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An electronic device comprising:
chip components aligned along a predetermined first direction and including respective terminal electrodes; and
a metal block including an electrode-opposing surface and a mounting surface, the electrode-opposing surface being opposed and connected to the respective terminal electrodes of the chip components continuously along the first direction, and the mounting surface being substantially perpendicular to the electrode-opposing surface and being substantially parallel to the first direction to oppose a land pattern when the electronic device is mounted on the land pattern.