US 12,432,858 B2
Module and method for manufacturing same
Minoru Hatase, Nagaokakyo (JP); and Yoshihito Otsubo, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto-Fu (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Sep. 22, 2022, as Appl. No. 17/934,328.
Application 17/934,328 is a continuation of application No. PCT/JP2021/005814, filed on Feb. 17, 2021.
Claims priority of application No. 2020-058303 (JP), filed on Mar. 27, 2020.
Prior Publication US 2023/0013032 A1, Jan. 19, 2023
Int. Cl. H05K 1/18 (2006.01); H05K 1/09 (2006.01); H05K 3/02 (2006.01); H05K 3/28 (2006.01); H05K 3/30 (2006.01)
CPC H05K 1/183 (2013.01) [H05K 1/092 (2013.01); H05K 3/02 (2013.01); H05K 3/284 (2013.01); H05K 3/301 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/10371 (2013.01); H05K 2203/1126 (2013.01); H05K 2203/1147 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A module comprising:
a substrate having a first surface and at least one recess on the first surface; and
an electronic component mounted on the first surface, wherein
the electronic component is connected to the substrate via a plurality of bumps,
all of the plurality of bumps are connected to the first surface inside any of the at least one recess,
a height of each of the plurality of bumps is greater than a depth of the at least one recess,
a part of the electronic component is located outside an outer periphery of any recess selected from the at least one recess when viewed in a direction perpendicular to the first surface, and
two or more bumps selected from the plurality of bumps are connected to the first surface in one recess selected from the at least one recess.