US 12,432,857 B2
Component mount board
Azumi Tominaga, Tokyo (JP)
Assigned to MEKTEC CORPORATION, Tokyo (JP)
Filed by MEKTEC CORPORATION, Tokyo (JP)
Filed on Sep. 18, 2023, as Appl. No. 18/468,832.
Claims priority of application No. 2022-185807 (JP), filed on Nov. 21, 2022.
Prior Publication US 2024/0172366 A1, May 23, 2024
Int. Cl. H05K 1/03 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H05K 3/30 (2006.01)
CPC H05K 1/182 (2013.01) [H05K 1/0313 (2013.01); H05K 3/0044 (2013.01); H05K 3/28 (2013.01); H05K 3/305 (2013.01); H05K 2203/0191 (2013.01); H05K 2203/0756 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A component mount board comprising:
a board having a base, a first conductive pattern formed on the base, a mount component electrically connected to the first conductive pattern, and a soluble layer; and
a second conductive pattern,
wherein the soluble layer is soluble in liquid, and the second conductive pattern is soluble in liquid or is weakened when getting wet with liquid,
the base has, in a portion of the base corresponding to the second conductive pattern, a first missing portion where the base is missing,
the first conductive pattern has a first portion and a second portion separated from the first portion through the first missing portion,
the second conductive pattern connects, over the first missing portion, the first and second portions of the first conductive pattern to each other, and
a portion of the second conductive pattern at least over the first missing portion is formed on a first surface of the soluble layer.