US 12,432,855 B2
Multiple circuit board assembly including a support element and method of manufacture thereof
Arjun Jayaprakash Guzar, Bangalore (IN); Joe Paul Moolanmoozha, Bangalore (IN); and Shailesh R. Nayak, Bangalore (IN)
Assigned to Sandisk Technologies, Inc., Milpitas, CA (US)
Filed by WESTERN DIGITAL TECHNOLOGIES, INC., San Jose, CA (US)
Filed on Jul. 26, 2023, as Appl. No. 18/359,592.
Claims priority of provisional application 63/488,812, filed on Mar. 7, 2023.
Prior Publication US 2024/0302876 A1, Sep. 12, 2024
Int. Cl. H05K 1/14 (2006.01)
CPC H05K 1/144 (2013.01) [H05K 1/141 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An electronic assembly, comprising:
a first circuit board;
a support element comprising a central member mounted to a first surface of the first circuit board, a plurality of first board fixing features extending from a first surface of the central member, and a plurality of second board fixing features extending from a second surface of the central member that is opposite the first surface, wherein a first end of the support element is defined by outer surfaces of the plurality of first board fixing features, and a second end of the support element opposite the first end is defined by outer surfaces of the plurality of second board fixing features;
a second circuit board contacting the first end of the support element and mounted to the plurality of first board fixing features;
a third circuit board contacting the second end of the support element and mounted to the plurality of second board fixing features;
a first inter-board connector extending between the first circuit board and the second circuit board; and
a second inter-board connector extending between the second circuit board and the third circuit board, wherein:
the first surface of the first circuit board comprises a major lower surface of the first circuit board;
the central member of the support element comprises a flat upper surface that contacts the major lower surface of the first circuit board;
the central member of the support element is mounted to the major lower surface of the first circuit board;
the first circuit board comprises a cutout region, and the second inter-board connector extends within the cutout region between the second circuit board and the third circuit board;
the plurality of first board fixing features extend from a lower surface of the central member, each of the first board fixing features comprising a lower surface that contacts an upper surface of the second circuit board;
the plurality of second board fixing features extend from an upper surface of the central member through the cutout region of the first circuit board, each of the second board fixing features comprising an upper surface that contacts a lower surface of the third circuit board; and
a pair of second board fixing features of the plurality of second board fixing features are located on opposite sides of the second inter-board connector and extend through a same cutout region of the first circuit board through which the second inter-board connector extends.