US 12,432,854 B2
Printed circuit board and disk device
Yoshihiro Amemiya, Chigasaki Kanagawa (JP)
Assigned to Kabushiki Kaisha Toshiba, Kawasaki (JP); and Toshiba Electronic Devices & Storage Corporation, Kawasaki (JP)
Filed by Kabushiki Kaisha Toshiba, Tokyo (JP); and Toshiba Electronic Devices & Storage Corporation, Tokyo (JP)
Filed on Mar. 6, 2023, as Appl. No. 18/178,877.
Claims priority of application No. 2022-118811 (JP), filed on Jul. 26, 2022.
Prior Publication US 2024/0040696 A1, Feb. 1, 2024
Int. Cl. G11B 5/012 (2006.01); H05K 1/11 (2006.01); H05K 3/10 (2006.01)
CPC H05K 1/111 (2013.01) [G11B 5/012 (2013.01); H05K 1/115 (2013.01); H05K 3/103 (2013.01); H05K 2201/0302 (2013.01); H05K 2201/0753 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A printed circuit board comprising:
an insulating layer;
a first conductive layer which is provided on one surface of the insulating layer and includes connection pads, a first mounting pad, a second mounting pad, and a second wiring connecting the first mounting pad and one of the connection pads;
a second conductive layer which is provided on another surface of the insulating layer and includes a third wiring connected to one of the connection pads; and
a conductive via which is provided penetrating the second conductive layer and the insulating layer and connects the second mounting pad and the third wiring, wherein
the first conductive layer includes a first reinforcing pattern extending from the second mounting pad in a direction different from a direction of the third wiring, and
the second conductive layer includes a pad portion provided on the third wiring and opposed to the second mounting pad with the insulating layer interposed therebetween, and a third reinforcing pattern extending from the pad portion and opposed to the first reinforcing pattern with the insulating layer interposed therebetween.