US 12,432,853 B2
Transparent conductive circuit
Richard P. Heroux, Seekonk, MA (US); Timothy Alan Turner, Pelham, NH (US); David J. Arthur, Braintree, MA (US); and Sean Patrick Arthur, Boston, MA (US)
Assigned to Chasm Advanced Materials, Inc., Canton, MA (US)
Filed by Chasm Advanced Materials, Inc., Canton, MA (US)
Filed on Mar. 1, 2024, as Appl. No. 18/592,813.
Application 18/592,813 is a continuation of application No. 17/424,935, granted, now 11,943,865, previously published as PCT/US2019/061231, filed on Nov. 13, 2019.
Claims priority of provisional application 62/760,376, filed on Nov. 13, 2018.
Prior Publication US 2024/0276638 A1, Aug. 15, 2024
Int. Cl. B41C 1/14 (2006.01); C23F 1/40 (2006.01); H01B 1/24 (2006.01); H05K 1/09 (2006.01); H05K 3/06 (2006.01)
CPC H05K 1/092 (2013.01) [B41C 1/14 (2013.01); C23F 1/40 (2013.01); H01B 1/24 (2013.01); H05K 3/067 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A transparent conductive film (TCF), comprising:
a substrate having a surface;
a metal mesh layer over at least a portion of the surface of the substrate, wherein the metal mesh layer comprises a network of interconnected metal traces with open spaces between the traces, wherein the metal mesh layer comprises at least 90% open spaces, and wherein the traces comprise two separate layers, one on top of the other; and
a conductive layer over the metal mesh layer, the conductive layer comprising carbon nanotubes (CNT) and a binder, wherein a ratio of binder:CNT in the conductive layer is greater than 120:1.