US 12,432,852 B2
Circuit board structure with embedded ceramic substrate and manufacturing process thereof
Yu-Hsien Liao, Taipei (TW); Shih-Han Wu, Taipei (TW); Jhih-Wei Lai, Taipei (TW); Jian-Yu Shih, Taipei (TW); and Ming-Yen Pan, Taipei (TW)
Assigned to TONG HSING ELECTRONIC INDUSTRIES, LTD., Taipei (TW)
Filed by TONG HSING ELECTRONIC INDUSTRIES, LTD., Taipei (TW)
Filed on May 3, 2023, as Appl. No. 18/142,974.
Claims priority of application No. 112104576 (TW), filed on Feb. 9, 2023.
Prior Publication US 2024/0276636 A1, Aug. 15, 2024
Int. Cl. H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/02 (2006.01); H05K 3/24 (2006.01); H05K 3/38 (2006.01)
CPC H05K 1/0306 (2013.01) [H05K 1/115 (2013.01); H05K 3/022 (2013.01); H05K 3/241 (2013.01); H05K 3/386 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A manufacturing process of a circuit board structure with an embedded ceramic substrate, the manufacturing process comprising:
a) providing a circuit substrate, the circuit substrate comprising an insulating base having two first surfaces opposite to each other, a first copper foil disposed on the two first surfaces of the insulating base and a through-hole portion disposed in the insulating base;
b) providing a ceramic substrate, the ceramic substrate comprising a ceramic base having two second surfaces opposite to each other and a second copper foil disposed on the two second surfaces of the ceramic base, and a plurality of positioning parts arranged between the insulating base and the ceramic base, wherein the ceramic substrate comprises at least one ceramic via hole, and the second copper foil is disposed on a wall surface of the ceramic via hole;
c) placing the ceramic substrate in the through-hole portion, wherein the positioning parts, the circuit substrate, and the ceramic substrate jointly defines:
a first gap arranged at a first side of the positioning parts; and
a second gap arranged at a second side of the positioning parts that is opposite to the first side;
d) disposing an adhesive layer between the insulating base and the ceramic base to seal the through-hole portion, wherein a first part of the adhesive layer is filled in the first gap, a second part of the adhesive layer is filled in the second gap and is separated from the first part through the positioning parts, and the positioning parts are embedded in the adhesive layer;
e) forming a metal layer on the first copper foil and the second copper foil; and
f) patterning the metal layer to form a circuit layer.