US 12,432,851 B2
Printed wiring board
Kenji Takahashi, Osaka (JP); Shoichiro Sakai, Osaka (JP); and Kou Noguchi, Osaka (JP)
Assigned to Sumitomo Electric Industries, Ltd., Osaka (JP)
Appl. No. 18/038,008
Filed by SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
PCT Filed Jun. 22, 2022, PCT No. PCT/JP2022/024889
§ 371(c)(1), (2) Date May 20, 2023,
PCT Pub. No. WO2023/276817, PCT Pub. Date Jan. 5, 2023.
Claims priority of application No. 2021-106970 (JP), filed on Jun. 28, 2021.
Prior Publication US 2023/0422396 A1, Dec. 28, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 1/16 (2006.01)
CPC H05K 1/0296 (2013.01) [H05K 1/165 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A printed wiring board comprising:
a base film having a main surface;
a wiring disposed on the main surface; and
at least one plating lead disposed on the main surface and connected to the wiring,
wherein
the at least one plating lead includes a first plating lead connected to the wiring at a first position, and a second plating lead connected to the wiring at a second position, and
an electric resistance value of the wiring between the first position and the second position is 20 or less,
wherein
the main surface is a first main surface and a second main surface opposite to the first main surface,
the wiring has a first wiring and a second wiring each disposed on the first main surface, and has a third wiring disposed on the second main surface,
the at least one plating lead further includes a third plating lead connected to the wiring at a third position, and
an electric resistance value of the wiring between the second position and the third position is 20 or less.