US 12,432,829 B2
Load drive device
Masaaki Nakayama, Kyoto (JP); Krishnachandran Krishnan Nair, Kyoto (JP); and Mathew George, Kyoto (JP)
Assigned to Rohm Co., Ltd., Kyoto (JP)
Filed by Rohm Co., Ltd., Kyoto (JP)
Filed on Aug. 2, 2023, as Appl. No. 18/364,017.
Application 18/364,017 is a continuation of application No. 17/879,123, filed on Aug. 2, 2022, granted, now 11,758,629.
Application 17/879,123 is a continuation of application No. 16/628,136, granted, now 11,438,981, issued on Sep. 6, 2022, previously published as PCT/JP2018/025023, filed on Jul. 2, 2018.
Claims priority of application No. 2017-130768 (JP), filed on Jul. 4, 2017.
Prior Publication US 2023/0380032 A1, Nov. 23, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05B 45/30 (2020.01); B60Q 1/04 (2006.01); B60Q 1/34 (2006.01); H02M 3/156 (2006.01); H05B 47/10 (2020.01); H10H 20/80 (2025.01); G05F 1/56 (2006.01); H02M 1/00 (2006.01)
CPC H05B 45/30 (2020.01) [B60Q 1/04 (2013.01); B60Q 1/34 (2013.01); H02M 3/156 (2013.01); H05B 47/10 (2020.01); H10H 20/80 (2025.01); G05F 1/56 (2013.01); H02M 1/0032 (2021.05)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a first voltage side terminal arranged to be connected to an external first voltage,
a second voltage side terminal arranged to be connected to an external second voltage different from the external first voltage,
a third terminal which is adjacent to the first voltage side terminal and is arranged to be connected to one terminal of an external resistor,
a current distributor configured to distribute a current to a direct path to the first voltage side terminal and to a loss path to the third terminal, and
a current driver configured to perform current control of a current including a current between the first voltage side terminal and the second voltage side terminal.