US 12,432,469 B2
Image pickup element and image pickup device
Shiro Tsunai, Kawasaki (JP); and Hironobu Murata, Yokohama (JP)
Assigned to NIKON CORPORATION, Tokyo (JP)
Filed by NIKON CORPORATION, Tokyo (JP)
Filed on Jun. 12, 2024, as Appl. No. 18/741,143.
Application 18/741,143 is a continuation of application No. 18/142,620, filed on May 3, 2023, granted, now 12,088,943.
Application 18/142,620 is a continuation of application No. 17/687,772, filed on Mar. 7, 2022, granted, now 11,689,832, issued on Jun. 27, 2023.
Application 17/687,772 is a continuation of application No. 16/737,993, filed on Jan. 9, 2020, granted, now 11,317,046, issued on Apr. 26, 2022.
Application 16/737,993 is a continuation of application No. 16/266,602, filed on Feb. 4, 2019, granted, now 10,574,918, issued on Feb. 25, 2020.
Application 16/266,602 is a continuation of application No. 15/793,495, filed on Oct. 25, 2017, granted, now 10,244,194, issued on Mar. 26, 2019.
Application 15/793,495 is a continuation of application No. 14/492,336, filed on Sep. 22, 2014, abandoned.
Application 14/492,336 is a continuation of application No. PCT/JP2013/002119, filed on Mar. 28, 2013.
Claims priority of application No. 2012-082158 (JP), filed on Mar. 30, 2012; and application No. 2012-104830 (JP), filed on May 1, 2012.
Prior Publication US 2024/0334086 A1, Oct. 3, 2024
Int. Cl. H04N 25/70 (2023.01); H04N 25/13 (2023.01); H04N 25/534 (2023.01); H04N 25/583 (2023.01); H04N 25/778 (2023.01); H04N 25/78 (2023.01); H04N 25/79 (2023.01); H10F 39/00 (2025.01); H10F 39/12 (2025.01); H10F 39/18 (2025.01)
CPC H04N 25/70 (2023.01) [H04N 25/134 (2023.01); H04N 25/534 (2023.01); H04N 25/583 (2023.01); H04N 25/778 (2023.01); H04N 25/78 (2023.01); H04N 25/79 (2023.01); H10F 39/182 (2025.01); H10F 39/199 (2025.01); H10F 39/8053 (2025.01); H10F 39/809 (2025.01); H10F 39/813 (2025.01); H10F 39/8063 (2025.01)] 20 Claims
OG exemplary drawing
 
1. An imaging sensor comprising:
a first semiconductor substrate that includes:
a first photoelectric conversion unit that converts, into electrical charges, light transmitted through a first filter having a first spectral characteristic; and
a second photoelectric conversion unit that converts, into electrical charges, light transmitted through a second filter having a second spectral characteristic, the second photoelectric conversion unit being arranged in a row direction side by side with the first photoelectric conversion unit;
a second semiconductor substrate that includes
a drive unit that performs a control such that an accumulation period of accumulating the electrical charges converted in the first photoelectric conversion unit is different from an accumulation period of accumulating the electrical charges converted in the second photoelectric conversion unit, the second semiconductor substrate being stacked with the first semiconductor substrate; and
a plurality of bonding units that electrically connect the first semiconductor substrate and the second semiconductor substrate, the plurality of bonding units having conductive components arranged facing each other in a stack direction in which the first semiconductor substrate and the second semiconductor substrate are stacked.