US 12,431,623 B2
Antenna module grounding for phased array antennas
Gordon Coutts, Woodinville, WA (US)
Assigned to Amazon Technologies, Inc., Seattle, WA (US)
Filed by Amazon Technologies, Inc., Seattle, WA (US)
Filed on Sep. 18, 2023, as Appl. No. 18/369,691.
Application 18/369,691 is a continuation of application No. 17/240,205, filed on Apr. 26, 2021, granted, now 11,843,187.
Prior Publication US 2024/0006763 A1, Jan. 4, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01Q 1/42 (2006.01); H01Q 5/378 (2015.01); H01Q 5/385 (2015.01); H01Q 5/392 (2015.01); H01Q 5/42 (2015.01); H01Q 9/04 (2006.01); H01Q 21/06 (2006.01)
CPC H01Q 5/42 (2015.01) [H01Q 5/378 (2015.01); H01Q 5/385 (2015.01); H01Q 5/392 (2015.01); H01Q 9/0414 (2013.01); H01Q 21/065 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a support structure;
a first plurality of antenna elements disposed on a first plane of the support structure, wherein two adjacent antenna elements of the first plurality of antenna elements are separated by a first distance;
a second plurality of antenna elements disposed on a second plane of the support structure, wherein two adjacent elements of the second plurality of antenna elements are separated by a second distance that is less than the first distance; and
a plurality of parasitic antenna elements disposed on the first plane of the support structure, wherein:
a first element of the two adjacent elements of the second plurality of antenna elements is disposed above a first element of the first plurality of antenna elements; and
a second element of the two adjacent elements of the second plurality of antenna elements is disposed above a first parasitic antenna element of the plurality of parasitic antenna elements.