US 12,431,611 B2
Semiconductor devices and methods of manufacturing semiconductor devices
Corey Reichman, Mesa, AZ (US); Kyoung Yeon Lee, Incheon (KR); Se Man Oh, Incheon (KR); and Byong Jin Kim, Seoul (KR)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Valley Point (SG)
Filed on Jun. 10, 2024, as Appl. No. 18/739,090.
Application 18/739,090 is a division of application No. 17/376,041, filed on Jul. 14, 2021, granted, now 12,046,798.
Prior Publication US 2024/0332781 A1, Oct. 3, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01Q 1/22 (2006.01); H01L 23/34 (2006.01); H01L 23/66 (2006.01); H01Q 9/04 (2006.01); H01Q 9/16 (2006.01); H01Q 23/00 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01L 23/34 (2013.01); H01L 23/66 (2013.01); H01Q 9/0414 (2013.01); H01Q 9/16 (2013.01); H01Q 23/00 (2013.01); H01L 2223/6677 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of manufacturing an electronic device, comprising:
providing a substrate having a substrate top side, a substrate bottom side, a first dielectric structure, and a first conductive structure, wherein:
the first conductive structure includes a transceiver pattern proximate to the substrate top side;
providing an antenna structure comprising:
a second dielectric structure coupled to the substrate top side;
a second conductive structure comprising a first antenna element, the first antenna element comprising:
a first antenna top side;
a first antenna bottom side; and
a first antenna lateral side connecting the first antenna top side to the first antenna bottom side; and
a first cavity below the first antenna element;
wherein:
the first antenna lateral side comprises a planar surface so that the first antenna element has a substantially uniform width in a cross-sectional view;
the first antenna element overlies the transceiver pattern;
the first cavity comprises a first cavity ceiling, a first cavity base, and a first cavity sidewall between the first cavity ceiling and the first cavity base; and
the first antenna bottom side defines the first cavity ceiling and a perimeter portion of the first antenna element including a part of the first antenna top side, a part of the first antenna bottom side, and the first antenna lateral side is fixed to and covered by the second dielectric structure; and
providing an electronic component coupled to the substrate bottom side and coupled to the transceiver pattern.