US 12,431,610 B2
Communication device and a method in a communication device
Linsheng Li, Shenzhen (CN); Hanyang Wang, Reading (GB); Alexander Khripkov, Helsinki (FI); Dongxing Tu, Shenzhen (CN); Hongting Luo, Shanghai (CN); and Zlatoljub Milosavljevic, Helsinki (FI)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by HUAWEI TECHNOLOGIES CO., LTD., Guangdong (CN)
Filed on May 11, 2023, as Appl. No. 18/196,278.
Application 18/196,278 is a continuation of application No. 16/956,475, granted, now 11,664,581, previously published as PCT/EP2017/083832, filed on Dec. 20, 2017.
Prior Publication US 2023/0282960 A1, Sep. 7, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H01Q 1/38 (2006.01); H01Q 21/28 (2006.01); H01Q 23/00 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01Q 1/243 (2013.01); H01Q 1/38 (2013.01); H01Q 21/28 (2013.01); H01Q 23/00 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A communication device, comprising:
a millimetre wave antenna arrangement comprising at least one distributed millimetre wave antenna radiating element and a fixed millimetre wave antenna radiating element, wherein the at least one distributed millimetre wave antenna radiating element comprises a first distributed millimetre wave antenna radiating element;
a Radio Frequency Integrated Circuit;
a first flexible transmission line;
a first substrate, wherein the first substrate is a rigid substrate, the fixed millimetre wave antenna radiating element and the Radio Frequency Integrated Circuit are arranged on the first substrate;
a second substrate, spaced apart from the first substrate, the second substrate is connected directly to the first substrate by the first flexible transmission line, wherein the first distributed millimetre wave antenna radiating element is arranged on the second substrate; and
a housing, comprises a front, a back cover and a surrounding frame which mounts the back cover to the front, wherein the millimetre wave antenna arrangement, the Radio Frequency Integrated Circuit, the first substrate, the second substrate and the first flexible transmission line are arranged in the housing,
wherein the Radio Frequency Integrated Circuit is configured to be connected to at least one of the fixed millimetre wave antenna radiating element or the at least one distributed millimetre wave antenna radiating element.