US 12,431,476 B2
Pixel package, method for forming the same, and display device using the same
Fu-Hsin Chen, Hsinchu (TW); Yu-Chun Lee, Hsinchu (TW); Cheng-Ta Kuo, Hsinchu (TW); Jian-Chin Liang, Hsinchu (TW); Tzong-Liang Tsai, Hsinchu (TW); Shiou-Yi Kuo, Hsinchu (TW); and Chien-Nan Yeh, Hsinchu (TW)
Assigned to LEXTAR ELECTRONICS CORPORATION, Hsinchu (TW)
Filed by Lextar Electronics Corporation, Hsinchu (TW)
Filed on May 9, 2022, as Appl. No. 17/739,310.
Claims priority of application No. 111105369 (TW), filed on Feb. 15, 2022.
Prior Publication US 2023/0260979 A1, Aug. 17, 2023
Int. Cl. H01L 25/16 (2023.01); H01L 23/00 (2006.01); H10H 20/01 (2025.01); H10H 20/851 (2025.01); H10H 20/852 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01)
CPC H01L 25/167 (2013.01) [H01L 24/20 (2013.01); H01L 24/95 (2013.01); H10H 20/852 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01); H01L 24/19 (2013.01); H01L 2224/19 (2013.01); H01L 2224/215 (2013.01); H01L 2224/95001 (2013.01); H10H 20/0362 (2025.01); H10H 20/0363 (2025.01); H10H 20/0364 (2025.01); H10H 20/8515 (2025.01)] 15 Claims
OG exemplary drawing
 
15. A display device, comprising:
a circuit substrate; and
a plurality of pixel packages disposed on the circuit substrate, wherein each of the pixel packages comprises:
a flexible redistribution layer;
a plurality of light-emitting diode chips arranged on a surface of the flexible redistribution layer in a clip-chip manner;
a plurality of light-adjusting layers respectively disposed on the light-emitting diode chips; and
a plurality of flexible composite laminates disposed on the surface of the flexible redistribution layer and between light-emitting diode chips, wherein each of the flexible composite laminates comprises a flexible reflection layer disposed on the flexible redistribution layer and a flexible light-shielding layer disposed on the flexible reflection layer.