US 12,431,451 B2
Semiconductor device
Nobuaki Okada, Kawasaki (JP)
Assigned to Kioxia Corporation, Tokyo (JP)
Filed by Kioxia Corporation, Tokyo (JP)
Filed on Sep. 7, 2022, as Appl. No. 17/930,149.
Claims priority of application No. 2022-046644 (JP), filed on Mar. 23, 2022.
Prior Publication US 2023/0307397 A1, Sep. 28, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01)
CPC H01L 24/08 (2013.01) [H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 2224/08146 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/14511 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a first semiconductor chip including an element and a first via provided in a first surface; and
a second semiconductor chip including a second via provided in a second surface and a circuit electrically coupled to the element through the first and second vias, and overlapping the first semiconductor chip in a first direction perpendicular to the first and second surfaces,
wherein
the first via includes a first side along a second direction parallel to the first surface, and a second side along a third direction parallel to the first surface and intersecting the second direction,
the second via includes a third side along the third direction and a fourth side along the second direction,
a dimension of the first side in the second direction is larger than a dimension of the second side in the third direction,
a dimension of the third side in the third direction is larger than a dimension of the fourth side in the second direction, and
the first via is in contact with the second via so that the first side intersects the third side.