US 12,431,449 B2
Circuitry for electrical redundancy in bonded structures
Javier A. DeLaCruz, San Jose, CA (US); Belgacem Haba, Saratoga, CA (US); and Jung Ko, San Jose, CA (US)
Assigned to Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US)
Filed by ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US)
Filed on Jun. 22, 2023, as Appl. No. 18/339,964.
Application 18/339,964 is a continuation of application No. 17/125,899, filed on Dec. 17, 2020, granted, now 11,721,653.
Claims priority of provisional application 62/953,084, filed on Dec. 23, 2019.
Prior Publication US 2023/0395544 A1, Dec. 7, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/00 (2006.01); G01R 31/27 (2006.01); G01R 31/28 (2006.01); H01L 25/065 (2023.01)
CPC H01L 24/06 (2013.01) [G01R 31/275 (2013.01); G01R 31/2856 (2013.01); H01L 24/08 (2013.01); H01L 25/0657 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A bonded structure comprising:
a first element having a first plurality of contact pads at a first surface, the first plurality of contact pads including a first contact pad and a second contact pad spaced apart from one another along the first surface;
a second element hybrid bonded to the first element without an intervening adhesive, the second element having a second plurality of contact pads at a second surface, the second plurality of contact pads including a third contact pad and a fourth contact pad spaced apart from one another along the second surface, wherein the first contact pad is disposed opposite to the third contact pad, and wherein the second contact pad is disposed opposite to the fourth contact pad; and
switching circuitry for selectively transferring an electrical signal either through the first and third contact pads or through the second and fourth contact pads, thereby providing redundant connections between the first and second elements.