US 12,431,439 B2
Semiconductor package and semiconductor device
Ryujiro Bando, Inagi (JP); and Hitoshi Ikei, Yokohama (JP)
Assigned to KIOXIA CORPORATION, Tokyo (JP)
Filed by KIOXIA CORPORATION, Tokyo (JP)
Filed on Oct. 26, 2023, as Appl. No. 18/494,827.
Application 18/494,827 is a continuation of application No. 17/200,411, filed on Mar. 12, 2021, granted, now 11,837,554.
Claims priority of application No. 2020-046800 (JP), filed on Mar. 17, 2020.
Prior Publication US 2024/0055370 A1, Feb. 15, 2024
Int. Cl. H01L 23/552 (2006.01); H05K 1/03 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01)
CPC H01L 23/552 (2013.01) [H05K 1/0306 (2013.01); H01L 23/49816 (2013.01); H01L 24/32 (2013.01); H01L 25/0657 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/14511 (2013.01); H05K 1/181 (2013.01); H05K 3/3494 (2013.01); H05K 2201/0112 (2013.01); H05K 2201/0175 (2013.01); H05K 2201/0989 (2013.01); H05K 2201/10159 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a semiconductor package including
a wiring substrate having a first surface and a second surface on a side opposite to the first surface and covered by a white solder resist,
a semiconductor chip provided on an upper side of the first surface of the wiring substrate,
a sealing resin covering the first surface of the wiring substrate and the semiconductor chip, and
an external terminal provided on the second surface of the wiring substrate, wherein
the wiring substrate being electrically connectable with a printed wiring board through the external terminal; and
a print wiring substrate including
a mounting substrate,
a wiring layer provided on an upper side of the mounting substrate and electrically connectable with the external terminal, and
an infrared absorption layer provided on an upper side of the wiring layer and formed of any of carbon black, carbon nanotube, diamond-like carbon, or insulation paste containing microcrystal diamond.