US 12,431,405 B2
Semiconductor device and method of forming thin heat sink using e-bar substrate
Jongtae Kim, Incheon (KR)
Assigned to STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed by STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed on Jul. 13, 2022, as Appl. No. 17/812,224.
Prior Publication US 2024/0021490 A1, Jan. 18, 2024
Int. Cl. H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01L 25/16 (2023.01)
CPC H01L 23/3675 (2013.01) [H01L 21/4882 (2013.01); H01L 23/49816 (2013.01); H01L 23/552 (2013.01); H01L 25/162 (2013.01); H01L 25/165 (2013.01); H01L 23/49833 (2013.01); H01L 23/5385 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/1611 (2013.01); H01L 2924/1616 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/1631 (2013.01); H01L 2924/16315 (2013.01); H01L 2924/1632 (2013.01)] 29 Claims
OG exemplary drawing
 
1. A method of making a semiconductor device, comprising:
disposing a semiconductor package over a substrate;
disposing an embedded bar (e-bar) substrate on the substrate around the semiconductor package with a height of the e-bar substrate above the substrate being less than a height of the semiconductor package above the substrate; and
forming a heat sink over the semiconductor package and supported by the e-bar substrate to elevate the heat sink from the substrate.