US 12,431,387 B2
Self-assembled monolayer for selective deposition
Xiangjin Xie, Fremont, CA (US); and Kevin Kashefi, San Ramon, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Dec. 17, 2021, as Appl. No. 17/554,869.
Prior Publication US 2023/0197508 A1, Jun. 22, 2023
Int. Cl. H01L 21/768 (2006.01); H01L 21/02 (2006.01); B05D 1/32 (2006.01); H01L 21/285 (2006.01)
CPC H01L 21/76834 (2013.01) [H01L 21/02063 (2013.01); H01L 21/76846 (2013.01); H01L 21/76861 (2013.01); H01L 21/76877 (2013.01); B05D 1/32 (2013.01); H01L 21/28562 (2013.01); H01L 2221/1063 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method of self-assembled monolayer (SAM) formation comprising:
exposing a substrate with an exposed metallic surface and an exposed non-metallic surface to a first precursor comprising phenanthroline or a phenanthroline derivative, and
depositing the self-assembled monolayer (SAM) on the exposed metallic surface, the SAM selectively forming on the metallic surface over the non-metallic surface.