US 12,431,383 B2
Substrate treating apparatus and substrate treating method
Won Sik Son, Gyeonggi-do (KR); Se Hoon Oh, Chungcheongnam-do (KR); and In Ki Jung, Gyeonggi-do (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-Do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Oct. 13, 2022, as Appl. No. 17/965,058.
Claims priority of application No. 10-2021-0136382 (KR), filed on Oct. 14, 2021.
Prior Publication US 2023/0119960 A1, Apr. 20, 2023
Int. Cl. H01L 21/687 (2006.01); B08B 3/04 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/68785 (2013.01) [B08B 3/041 (2013.01); H01L 21/67023 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An apparatus for treating a substrate, the apparatus comprising:
a processing vessel having a processing space;
a support unit for supporting the substrate in the processing space and rotating the substrate;
a liquid supply unit for supplying a processing liquid to the substrate supported by the support unit; and
a heating unit for heating the substrate,
wherein the support unit includes:
a spin chuck;
a rotation driver for rotating the spin chuck;
a chuck pin installed on the spin chuck so as to be rotated together with the spin chuck; and
a chuck pin moving unit comprising at least one clutch module, wherein the chuck pin moving unit is configured for moving the chuck pin between a contact position at which the chuck pin is in contact with a side portion of the substrate and an open position at which the chuck pin is spaced apart from the side portion of the substrate, and
wherein the chuck pin moving unit moves the chuck pin while the substrate is being rotated by the spin chuck, and the at least one clutch module is rotated together with the spin chuck.