US 12,431,382 B2
Integrated wafer debonding and cleaning apparatus and debonding and cleaning method
Chih-cheng Wang, Hsinchu (TW); Zong-en Wu, Hsinchu (TW); and Yun-cheng Chiu, Hsinchu (TW)
Assigned to GRAND PROCESS TECHNOLOGY CORPORATION, Hsinchu (TW)
Filed by GRAND PROCESS TECHNOLOGY CORPORATION, Hsinchu (TW)
Filed on Feb. 2, 2023, as Appl. No. 18/104,982.
Claims priority of application No. 111119934 (TW), filed on May 27, 2022.
Prior Publication US 2023/0386885 A1, Nov. 30, 2023
Int. Cl. H01L 21/683 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/6835 (2013.01) [H01L 21/67092 (2013.01); H01L 2221/68381 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An integrated wafer debonding and cleaning apparatus, comprising:
an input port configured to allow a substrate to be processed to enter the integrated wafer debonding and cleaning apparatus, wherein the substrate to be processed comprises a wafer and a carrier which are bonded;
a debonding module configured to debond the substrate to be processed, and to separate the wafer from the carrier;
a wafer cleaning device configured to clean the wafer;
a first output port configured to allow the cleaned wafer to exit the integrated wafer debonding and cleaning apparatus;
a second output port configured to allow the carrier to exit the integrated wafer debonding and cleaning apparatus; and
a transport device configured to transport the substrate to be processed, the wafer, and the carrier, wherein the transport device runs between the input port, the debonding module, the wafer cleaning device, the first output port, and the second output port; and
wherein the wafer cleaning device comprises a first chamber and a second chamber, and the first chamber and the second chamber are respectively configured to clean two opposite surfaces of the wafer.