| CPC H01L 21/6835 (2013.01) [C09J 5/06 (2013.01); C09J 7/35 (2018.01); H01L 25/0753 (2013.01); H10H 20/857 (2025.01); C09J 2301/16 (2020.08); C09J 2301/304 (2020.08); C09J 2301/416 (2020.08); C09J 2301/502 (2020.08); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H10H 20/0364 (2025.01)] | 14 Claims |

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1. A method of transferring components, the method comprising:
providing a first substrate with the components;
providing a second substrate with an adhesive layer comprising a hot melt adhesive material;
contacting, while the adhesive layer is in a melted state, the components on the first substrate with the adhesive layer on the second substrate;
letting the adhesive layer solidify, after the contacting, to form an adhesive connection between the components and the second substrate;
moving apart, after letting the adhesive layer solidify, the first substrate and the second substrate to affect a transfer of the components from the first substrate to the second substrate by using the adhesive connection of the adhesive layer; and
transferring, after the moving apart, at least a first subset of the components from the second substrate to a third substrate by radiating light onto at least a first set of adhesive regions of the adhesive layer holding the at least first subset of components,
wherein the light causes the adhesive material at the first set of adhesive regions to melt and thereby causes a release of the at least first subset of components for transfer to the third substrate,
wherein the light causes at least the first set of adhesive regions to melt and form one or more respective jets of melted adhesive material, and
wherein the at least first subset of components is transferred over a distance to the third substrate with the jets of melted adhesive material propelling the first subset of components from the second substrate towards the third substrate.
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