US 12,431,379 B2
Ceramic substrate, method of manufacturing the ceramic substrate, electrostatic chuck, substrate fixing device, and package for semiconductor device
Akira Goto, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on May 17, 2023, as Appl. No. 18/318,831.
Claims priority of application No. 2022-082151 (JP), filed on May 19, 2022.
Prior Publication US 2023/0377933 A1, Nov. 23, 2023
Int. Cl. H01L 21/683 (2006.01); B32B 18/00 (2006.01); H01L 23/498 (2006.01); H01T 23/00 (2006.01); B32B 3/30 (2006.01)
CPC H01L 21/6833 (2013.01) [B32B 18/00 (2013.01); H01L 23/49822 (2013.01); H01L 23/49894 (2013.01); B32B 3/30 (2013.01); B32B 2264/1023 (2020.08); B32B 2264/303 (2020.08); B32B 2457/14 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A ceramic substrate comprising:
a base body; and
an electrical conductor pattern embedded in the base body,
wherein the base body is composed of ceramics, and
wherein the electrical conductor pattern has, as a main component, a solid solution having a body-centered cubic lattice structure in which cobalt and iron are solid-dissolved in tungsten, a solid solution in a body-centered cubic lattice structure in which cobalt and silicon are solid-dissolved in tungsten, a solid solution having a body-centered cubic lattice structure in which cobalt and manganese are solid-dissolved in tungsten, or a solid solution having a body-centered cubic lattice structure in which cobalt and nickel are solid-dissolved in tungsten.