US 12,431,376 B2
Semiconductor process chamber, semiconductor process equipment, and semiconductor process method
Yongfei Wang, Beijing (CN); Qing She, Beijing (CN); and Yunfeng Lan, Beijing (CN)
Assigned to BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD., Beijing (CN)
Appl. No. 18/687,217
Filed by BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD., Beijing (CN)
PCT Filed Aug. 29, 2022, PCT No. PCT/CN2022/115371
§ 371(c)(1), (2) Date Feb. 27, 2024,
PCT Pub. No. WO2023/030214, PCT Pub. Date Mar. 9, 2023.
Claims priority of application No. 202111014254.5 (CN), filed on Aug. 31, 2021.
Prior Publication US 2024/0371672 A1, Nov. 7, 2024
Int. Cl. H01L 21/677 (2006.01); C23C 16/44 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67751 (2013.01) [C23C 16/4408 (2013.01); C23C 16/4409 (2013.01); H01L 21/67196 (2013.01); H01L 21/68742 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A semiconductor process chamber, comprising:
a reaction chamber;
a transfer chamber located below the reaction chamber, wherein the reaction chamber is connected to the transfer chamber through a bottom opening;
a base with a lifting shaft connected to a bottom of the base, wherein the base is able to rise and descend between the reaction chamber and the transfer chamber through the bottom opening;
a sealing ring; and
a first elastic sealing cylinder;
wherein:
the sealing ring and the first elastic sealing cylinder are disposed below the base and surrounding the lifting shaft of the base;
a top end of the first elastic sealing cylinder is sealingly connected to a bottom wall of the sealing ring in an inner hole of the sealing ring;
a bottom end of the first elastic sealing cylinder is sealingly connected to the bottom wall of the transfer chamber at a through-hole of the bottom of the transfer chamber for the lifting shaft to pass through; and
when the base rises into the reaction chamber the first elastic sealing cylinder drives the sealing ring to rise through an elastic force and seal the bottom opening of the reaction chamber.