US 12,431,369 B2
Substrate processing apparatus
Shuhei Nemoto, Kyoto (JP); Kazuhiro Shoji, Kyoto (JP); and Ryo Muramoto, Kyoto (JP)
Assigned to SCREEN HOLDINGS CO., LTD., (JP)
Filed by SCREEN Holdings Co., Ltd., Kyoto (JP)
Filed on Mar. 8, 2023, as Appl. No. 18/180,405.
Claims priority of application No. 2022-046649 (JP), filed on Mar. 23, 2022.
Prior Publication US 2023/0307256 A1, Sep. 28, 2023
Int. Cl. H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67051 (2013.01) [H01L 21/68785 (2013.01); H01L 21/6708 (2013.01); H01L 21/68792 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a substrate holder configured to suck and hold a central part of a lower surface of a substrate and provided rotatably about an axis of rotation extending in a vertical direction:
a rotating mechanism configured to output a rotational driving force for rotating the substrate holder,
a processing mechanism configured to process the substrate by supplying a processing liquid to the substrate held by the substrate holder; and
a rotating cup configured to collect liquid droplets of the processing liquid scattered from the substrate and provided rotatably about the axis of rotation while surrounding an outer periphery of the rotating substrate, wherein
the rotating mechanism includes a power transmitter configured to transmit a part of the rotational driving force as a cup driving force to the rotating cup, the rotating mechanism configured to simultaneously rotate the substrate holder and the rotating cup by the rotational driving force.