US 12,431,364 B2
Method for manufacturing packaging enclosure and method for manufacturing packaging chip
Yiqun Wang, Wuhan (CN); Song Wang, Wuhan (CN); Yuan Sun, Wuhan (CN); and Tianjian Liu, Wuhan (CN)
Assigned to Hubei Yangtze Pilot-Line Services Co., Ltd., Hubei (CN)
Appl. No. 18/246,281
Filed by Hubei Yangtze Pilot-Line Services Co., Ltd., Hubei (CN)
PCT Filed Jun. 30, 2022, PCT No. PCT/CN2022/102669
§ 371(c)(1), (2) Date Mar. 22, 2023,
PCT Pub. No. WO2023/178874, PCT Pub. Date Sep. 28, 2023.
Claims priority of application No. 202210283093.8 (CN), filed on Mar. 22, 2022.
Prior Publication US 2024/0312794 A1, Sep. 19, 2024
Int. Cl. H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 23/04 (2006.01)
CPC H01L 21/481 (2013.01) [H01L 21/52 (2013.01); H01L 23/04 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A method for manufacturing a packaging enclosure, comprising:
providing a substrate which has a first surface and a second surface opposite to each other;
forming a hole in the first surface of the substrate, bottom of the hole being located in the substrate;
bonding the first surface of the substrate with the formed hole onto a carrier which covers the hole;
forming, a groove, in the second surface of the substrate after bonding the first surface onto the carrier, the groove being communicated with the hole in a direction perpendicular to the substrate;
fixing the second surface of the substrate with the formed groove to a bearing layer;
removing the carrier after fixing the second surface to the bearing layer; and
removing the bearing layer after removing the carrier.